Get Advanced Materials for Thermal Management of Electronic PDF

By Xingcun Colin Tong

ISBN-10: 1441977589

ISBN-13: 9781441977588

The desire for complicated thermal administration fabrics in digital packaging has been well known as thermal demanding situations turn into limitations to the digital industry’s skill to supply persevered advancements in machine and method functionality. With elevated functionality requisites for smaller, extra able, and extra effective digital energy units, platforms starting from lively electronically scanned radar arrays to internet servers all require elements that may burn up warmth successfully. This calls for that the fabrics have excessive potential of dissipating warmth and protecting compatibility with the die and digital packaging. in keeping with serious wishes, there were innovative advances in thermal administration fabrics and applied sciences for lively and passive cooling that promise integrable and low-cost thermal administration suggestions. This ebook meets the necessity for a entire method of complex thermal administration in digital packaging, with assurance of the basics of warmth move, part layout directions, fabrics choice and evaluate, air, liquid, and thermoelectric cooling, characterization innovations and technique, processing and production know-how, stability among rate and function, and alertness niches. the ultimate bankruptcy provides a roadmap and destiny viewpoint on advancements in complex thermal administration fabrics for digital packaging. Key gains: •Covers ceramics and glasses, polymers, metals, metal composites, multi-material laminates, carbonaceous fabrics, and carbon-matrix composites •Provides the reader with a entire realizing of thermal administration options •Includes basics of warmth move and fabrics characterization options •Assesses price and function in thermal management

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Extra resources for Advanced Materials for Thermal Management of Electronic Packaging

Sample text

Whatever direction the future of the industry leads, the problem of heat dissipation has no magic solution. As the processor density continues to increase, so does the need for better methods of heat dissipation (Wirth 2004). Thermal Management Solutions 25 Optimal Thermal Design of a Package The optimal thermal design is a fundamental approach for future micro- and nanoscale electrothermal modeling, engineering, and processing as well as present packaging thermal management, based on the minimization of thermal resistance.

Fan heat sinks, high fin density assemblies, as well as board-level coolers are manufactured and configured for either impingement or cross-flow environments. Fan solutions include passive-active and active approaches. With a passive-active approach, fan heat sink solutions provide air flow and require little or no system air flow, while active fan heat sink solutions incorporate a fan that is attached to the solution. The air flow that a fan produces blows parallel to the fan’s blade axis (Madrid 2000).

Radiation can occur in a vacuum because no medium between the two surfaces is required as in conduction and convection (Couvillion 2006). Conduction Thermal conduction is a process in which heat flows through a solid, liquid, or gas or between two media that are in intimate contact. Conduction is the dominant mechanism for heat transfer within solids, involving the transfer of kinetic thermal energy from one electron to another to cause no visible motion of the particles of the body. Conduction through dielectric solids is almost entirely due to lattice vibrations, while conduction through metallic solids has added energy transport by free electrons.

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Advanced Materials for Thermal Management of Electronic Packaging by Xingcun Colin Tong


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